HEAT DISSIPATION SET, OPTICAL MODULE SET AND COMMUNICATIONS DEVICE

专利摘要:
heat dissipation mechanism, optical module mechanism and communications device. Embodiments of the present invention disclose a heat dissipation mechanism configured to dissipate heat to a heat emitting device, where the heat dissipation mechanism includes: a cage, a tec mechanism, a mounting case, an elastic carrier, and a heat pipe, where a window is provided on a side face of the cage, the tec mechanism is located on an outer side of the cage, and a cold side of the tec mechanism passes through the window and thermally communicates with the heat emitting device in the cage so as to dissipate heat from the heat emitting device; the mounting case is configured to mount the tec mechanism and allow the tec mechanism to travel in a direction away from or closer to the heat emitting device; and a heat-absorbing portion of the heat tube is mounted on the elastic carrier, and the heat-absorbing portion of the heat tube and which is mounted on the elastic carrier thermally communicates with a hot side of the thermal mechanism. , so as to dissipate heat from the tec mechanism by using the heat pipe, where one side of the elastic carrier facing away from the tec mechanism presses against a cage device.
公开号:BR102016026795A2
申请号:R102016026795-1
申请日:2016-11-16
公开日:2021-08-03
发明作者:Xingxing HUANG；Kaikai Liu；Shineng CHEN
申请人:Huawei Technologies Co., Ltd.；
IPC主号:

专利说明:

[0001] [001] The present invention relates to the field of electronic communications technologies, and in particular, to a heat dissipation mechanism and a communications device. FUNDAMENTALS
[0002] [002] In a radio frequency module, an optical module is often used as several interfaces, such as a service interface, a transmission interface and an interconnection interface. With the development of communication technologies, the rate and bandwidth of an optical module continuously increase and, consequently, the power consumption of the optical module increases, and the optical module generates an increasing amount of heat. Therefore, the optical module has an increasingly high requirement for heat dissipation efficiency. SUMMARY
[0003] [003] In view of this, embodiments of the present invention provide a heat dissipation mechanism and a communications device that uses the heat dissipation mechanism to implement efficient heat dissipation for an optical module.
[0004] [004] According to a first aspect, an embodiment of the present invention provides a heat dissipation mechanism, configured to dissipate heat to a heat emitting device, where the heat dissipation mechanism includes: a cage, a Cooling mechanism Thermoelectric (TEC), a mounting case, an elastic carrier, and a heat tube, where a window is provided on a side face of the cage, the TEC mechanism is located on an outer side of the cage, and a cold side of the mechanism TEC passes through the window and thermally communicates with the heat emitting device in the cage so as to dissipate heat from the heat emitting device; the mounting case is configured to mount the TEC mechanism and allow the TEC mechanism to travel in a direction away from or closer to the heat emitting device; and a heat absorbing portion of the heat tube is mounted on the elastic carrier, and the heat absorbing portion of the heat tube and which is mounted on the elastic carrier thermally communicates with a hot side of the TEC mechanism , in order to dissipate heat from the TEC mechanism by using the heat pipe, where one side of the elastic carrier facing away from the TEC mechanism presses against a cage device, and the elastic carrier is configured for: when the heat emitting device is inserted into the cage and applies an extrusion force to the outside of the cage, and the extrusion force is transferred to the TEC mechanism through the window and transferred to the elastic carrier from the TEC mechanism, undergoes elastic deformation and provides a reaction force to the TEC mechanism and the heat emitting device.
[0005] [005] When an ambient temperature of the heat emitting device is excessively high, the TEC mechanism absorbs heat from the heat emitting device on the cold side of the TEC mechanism by means of a thermoelectric effect, and releases heat on the hot side, so as to form a cool local area that surrounds the heat emitting device and helps satisfy a heat emitting device's requirement for an operating temperature.
[0006] [006] When the heat emitting device is inserted into the cage, the heat emitting device and the cold side of the TEC mechanism undergo a press fit. The heat emitting device pushes the TEC mechanism, and then the TEC mechanism moves in a direction away from the heat emitting device, causing the elastic carrier carrying the heat tube to move in the direction away from the heat emitting device. of the heat emitting device. The elastic carrier is compressed to generate a rebound force towards the heat emitting device, allowing the cold side of the TEC mechanism to come into close contact with the heat emitting device, or, in a case where a thermally conductive medium is provided between the cold side of the TEC mechanism and the heat emitting device, allowing the cold side of the TEC mechanism to be in close contact with the thermally conductive medium and allowing the thermally conductive medium to be in close contact with the heat emitting device. Therefore, the thermal resistance between the cold side of the TEC mechanism and the heat emitting device is relatively small, and good thermal conduction is implemented. In addition, the rebound force also allows the heat absorbing portion of the heat tube to be in close contact with the hot side of the TEC mechanism, or, in a case where a thermally conductive medium is provided between the absorbing portion. heat pipe and the heat pipe and the hot side of the TEC mechanism, allows the heat absorbing portion of the heat pipe to be in close contact with the thermally conductive medium, and allows the thermally conductive medium to be in close contact with the hot side of the TEC mechanism. Therefore, the thermal resistance between the heat pipe and the hot side of the TEC mechanism is also relatively small. In summary, when the heat emitting device is inserted into the cage, under the action of the rebound force of the elastic carrier, the thermal contact resistance is relatively small in a thermal conduction path from the heat emitting device to the TEC mechanism and from the TEC mechanism to the heat pipe, facilitating the dissipation of heat generated by the heat emitting device.
[0007] [007] When the heat emitting device is removed from the cage, the elastic carrier recovers from the deformation, and the TEC mechanism moves towards the cage and reestablishes its original location.
[0008] [008] In the thermal conduction path from the heat emitting device to the TEC mechanism and from the TEC mechanism and the heat tube, for the reason that an absolutely precise machining of a device is impossible, each device in the thermal conduction path has a machining tolerance. Therefore, a greater number of devices in the thermal conduction path indicates a greater accumulated tolerance, and the existence of a tolerance causes a phenomenon that devices cannot properly fit with each other.
[0009] [009] When the heat emitting device is inserted into the cage, under the action of the rebound force (or can be called the resilience force) of the elastic carrier, the tolerance between devices can be compensated, facilitating proper adjustment between the devices . Thus, the thermal contact resistance is relatively small, facilitating the dissipation of the heat generated by the heat emitting device.
[0010] [010] Correspondingly, in a case where the heat emitting device is an optical module, the heat dissipation mechanism can also efficiently dissipate heat to the optical module in the aforementioned manner.
[0011] [011] In a first possible mode of implementing the first aspect, the elastic carrier includes a transport base, and a material of the transport base is an elastic material.
[0012] [012] With reference to the first aspect or the first possible mode of implementation of the first aspect, in a second possible mode of implementation, there is a transport base and at least one heat pipe, and the heat absorbing portion of the at least a heat pipe is mounted on a transport base; or there are multiple transport bases and multiple heat tubes, and the multiple heat tubes are mounted on the multiple transport bases in a distributed mode.
[0013] [013] With reference to the first aspect or the first possible mode of implementation of the first aspect or the second possible mode of implementation of the first aspect, in a third possible mode of implementation, the heat absorbing portion of the heat pipe is mounted on a side face of the transport base; or the heat absorbing portion of the heat tube is mounted in a receiving groove cutout in the transport base; or the heat absorbing portion of the heat pipe is embedded in the transport base.
[0014] [014] With reference to the first aspect or the first possible mode of implementation of the first aspect or the second possible mode of implementation of the first aspect or the third possible mode of implementation of the first aspect, in a fourth possible mode of implementation, a party that is from the heat-absorbing portion of the heat tube and which protrudes from the transport base and makes contact with the hot side of the TEC mechanism; or a heat pad is used to conduct heat between a portion which is of the heat absorbing portion of the heat tube and which protrudes from the transport base and the hot side of the TEC mechanism; or the transport base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism, where the transport base is a thermal conductor; or a thermally conductive medium provided in the transport base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism.
[0015] [015] In a fifth possible mode of implementing the first aspect, an elastic carrier includes a support base, and an elastic element located on a side of the support base facing away from the TEC mechanism.
[0016] [016] With reference to the first aspect or the fifth possible mode of implementation of the first aspect, in a sixth possible mode of implementation, there is a support base and at least one heat pipe, and the heat absorption portion of the at least a heat pipe is mounted on a support base; or there are multiple support bases and multiple heat tubes, and the multiple heat tubes are mounted on the multiple support bases in a distributed fashion.
[0017] [017] With reference to the first aspect or the fifth possible mode of implementation of the first aspect or the sixth possible mode of implementation of the first aspect, in a seventh possible mode of implementation, the heat absorbing portion of the heat pipe is mounted on a side face of the support base; or the heat absorbing portion of the heat tube is mounted in a receiving groove cutout in the support base; or the heat absorbing portion of the heat pipe is built into the support base.
[0018] [018] With reference to the first aspect or the fifth possible mode of implementation of the first aspect or the sixth possible mode of implementation of the first aspect or the seventh possible mode of implementation of the first aspect, in an eighth possible mode of implementation, a part that it is from the heat-absorbing portion of the heat tube that protrudes from the support base and makes contact with the hot side of the TEC mechanism; or a thermal pad is used to conduct heat between a portion which is of the heat absorbing portion of the heat tube and which protrudes from the support base and the hot side of the TEC mechanism; or the support base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism, where the support base is a thermal conductor; or a thermally conductive medium provided in the support base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism.
[0019] [019] With reference to the first aspect or any of the first to eighth possible modes of implementation of the first aspect, in a ninth possible mode of implementation, the fact that one side of the elastic carrier facing outward of the TEC mechanism presses against a cage device specifically includes: the cage device is a heat sink, the elastic carrier is a thermal conductor, the elastic carrier side facing away from the TEC mechanism. it presses against the heat sink, and the hot side of the TEC mechanism transfers heat to the heat sink through the elastic conveyor.
[0020] [020] With reference to the first aspect or any of the first to ninth possible modes of implementation of the first aspect, in a tenth possible mode of implementation, the heat-absorbing portion of the heat pipe is located at one end of the heat pipe. heat, or in any section of the entire heat pipe.
[0021] [021] With reference to the first aspect or any of the first to tenth possible modes of implementation of the first aspect, in an eleventh possible mode of implementation, the mounting case is mounted on the outer side of the cage.
[0022] [022] Mounting the mounting case on the outside of the cage helps to implement good thermal conduction between the cold side of the TEC mechanism and the heat emitting device. In addition, mounting the mounting case on the outside of the cage allows the TEC mechanism to be quickly and conveniently attached to the cage, which makes mounting easy.
[0023] [023] With reference to the first aspect or any one of the first to eleventh possible modes of implementation, in a twelfth possible mode of implementation, the mounting case is a fastener, the fastener includes two clamping plates arranged oppositely and at least two elastic arms which are connected between the two anchor plates, one elastic arm of the at least two elastic arms is connected at the top of one end of the two anchor plates, and the other elastic arm of the at least two elastic arms is connected to the top of the other end of the two clamping plates.
[0024] [024] With reference to the twelfth possible mode of implementation of the first aspect, in a thirteenth possible mode of implementation, the fastener fixing plates are mounted on the outer faces of two opposite side walls of the cage.
[0025] [025] With reference to the twelfth possible mode of implementation of the first aspect or the thirteenth possible mode of implementation of the first aspect, in a fourteenth possible mode of implementation, the elastic arms of the fastener secure the TEC mechanism on the outside of the cage.
[0026] [026] With reference to the twelfth possible mode of implementation of the first aspect or the thirteenth possible mode of implementation of the first aspect or the fourteenth possible mode of implementation of the first aspect, in a fifteenth possible mode of implementation, the at least two elastic arms of the fastener press against a metal base of the TEC mechanism, where a portion of the metal base protrudes from at least two opposite sides of the TEC mechanism, and the elastic arms of the fastener press against the protruding part of the metal base.
[0027] [027] With reference to the first aspect or any of the first to tenth possible modes of implementation of the first aspect, in a sixteenth possible mode of implementation, the mounting case includes at least two support bars and at least one elastic beam , the elastic beam presses against the TEC mechanism, the at least two support bars are connected to the elastic beam at one end, the support bars are mounted on a circuit board at the other end, and the cage is also mounted on the circuit board.
[0028] [028] Mounting the mounting case onto the circuit board is easy and secure and facilitates removal.
[0029] [029] With reference to the sixteenth possible mode of implementation of the first aspect, in a seventeenth possible mode of implementation, the elastic beam presses against a metal base of the TEC mechanism, where a part of the metal base protrudes from at least two opposite sides of the TEC mechanism, and the elastic beam presses against the protruding part of the metal base.
[0030] [030] With reference to the first aspect or any of the first through seventeenth possible modes of implementation of the first aspect, in an eighteenth possible mode of implementation, the fact that the window is provided on a side face of the cage specifically includes: the window is provided at the top of the cage.
[0031] [031] Correspondingly, the fact that the TEC mechanism is located on an outer side of the cage includes: the TEC mechanism is located on top of the cage.
[0032] [032] With reference to the first aspect or any of the first to eighteenth possible modes of implementation of the first aspect, in a nineteenth possible mode of implementation, a window location is close to an opening edge of the cage, and the Heat emitting device is inserted into the cage through the opening. In a case where the heat emitting device is an ©optic module, the design allows the TEC mechanism to better cool a transmitter optical sub-mechanism device (TOSA) or a receiver optical sub-mechanism device (ROSA) that is of the module tico and that it is near a location of the opening of the cage.
[0033] [033] With reference to the first aspect or any one of the first through nineteenth possible modes of implementation of the first aspect, in a twentieth possible mode of implementation, the fact that a cold side of the TEC engine crosses the window and communicates thermally with the heat emitting device in the cage specifically includes: the cold side of the TEC mechanism passes through the window and thermally communicates with a surface of the heat emitting device in the cage.
[0034] [034] With reference to the first aspect or any of the first through the twentieth possible modes of implementation of the first aspect, in a twenty-first possible mode of implementation, the fact that a cold side of the TEC mechanism crosses the window and communicates thermally with the heat emitting device in the cage specifically includes: the cold side of the TEC mechanism passes through the window and thermally communicates with the upper surface of the heat emitting device in the cage.
[0035] [035] With reference to the first aspect or any of the first to twenty-first possible modes of implementation of the first aspect, in a twenty-second possible mode of implementation, the fact that a cold side of the TEC mechanism crosses the window and communicates thermally with the heat emitting device in the cage specifically includes: the cold side of the TEC mechanism passes through the window and makes contact with a surface of the heat emitting device in the cage; or A thermal pad is provided between the cold side of the TEC mechanism and a surface of the heat emitting device, and the cold side of the TEC mechanism passes through the window and dissipates heat from the heat emitting device by using the thermal pad.
[0036] [036] The thermal resistance between the cold side of the TEC mechanism and the heat emitting device can be decreased by providing the thermal pad. Furthermore, when all elements in the heat dissipation mechanism are assembled together, the tolerances of all devices in the heat dissipation mechanism can be absorbed through deformation of the thermal pad. Furthermore, when the heat emitting device is inserted into the cage, an extrusion force exerted by the heat emitting device can also cause deformation of the thermal pad; and, therefore, the thermal pad can still absorb a displacement of the TEC mechanism or the like caused when the heat emitting device is inserted or removed.
[0037] [037] With reference to the first aspect or any of the first to twenty-second possible modes of implementation of the first aspect, in a twenty-third possible mode of implementation, the fact that the heat-absorbing portion that is the heat pipe and is mounted on the elastic conveyor thermally communicating with a hot side of the TEC mechanism includes: the heat absorbing portion which is of the heat tube and which is mounted on the elastic carrier makes contact with the hot side of the TEC mechanism; or A thermally conductive medium is used to conduct heat between the heat absorbing portion which is of the heat pipe and is mounted on the elastic carrier and the hot side of the TEC mechanism.
[0038] [038] With reference to the first aspect or any of the first to twenty-third possible modes of implementation of the first aspect, in a twenty-fourth possible mode of implementation, the heat emitting device is an optical module.
[0039] [039] With reference to the first aspect or any of the first to twenty-four possible modes of implementation of the first aspect, in a twenty-fifth possible mode of implementation, the heat dissipation mechanism further includes the heat emitting device, and the Heat emitting device is located in the cage of the heat dissipation mechanism.
[0040] [040] According to a second aspect, an embodiment of the present invention provides an optical module mechanism, which includes an optical module, a connector, and the heat dissipation mechanism according to the first aspect or any of the first to twenty-four possible modes of implementation of the aforementioned first aspect, where the optical module acts as the heat emitting device of the heat dissipation mechanism according to the first aspect or any of the first to twenty-fourth possible modes of implementation of the first aspect mentioned above, the optical module and connector are located in the heat dissipation mechanism cage, and the optical module and connector are communicatively connected.
[0041] [041] According to a third aspect, an embodiment of the present invention provides a communication device, where the communication device includes a housing, a circuit board, a connector, and a heat dissipation mechanism according to the first aspect or any of the first through eighth and tenth through twenty-fifth possible modes of implementation of the aforementioned first aspect, where the circuit board, the connector, and the heat dissipation mechanism are located in the housing, the connector and the cage are positioned on the same surface of the circuit board, the connector is located in the cage at one end of the cage, and the heat emitting device is inserted into the cage from one end of the cage facing away from the connector and is communicatively connected to the connector.
[0042] [042] With reference to the third aspect, in a first possible mode of implementation, the casing functions as the locking device in the heat dissipation mechanism according to the first aspect or any one of the first to eighth and tenth to twenty-fifth possible modes of implementing the above-mentioned first aspect, and the side of the elastic carrier facing away from the TEC mechanism presses against the casing.
[0043] [043] With reference to the third aspect, in a second possible mode of implementation, the enclosure includes an upper frame box and a lower frame box, the upper frame box functions as the locking device in the heat dissipation mechanism of according to the first aspect or any one of the first to eighth and tenth to twenty-fifth possible modes of implementing the above-mentioned first aspect, and the outward-facing elastic carrier side of the TEC mechanism presses against the upper frame box.
[0044] [044] With reference to the third aspect, in a third possible mode of implementation, the communications device further includes a heat sink, the heat sink functions as the entrapment device in the heat dissipation mechanism according to the first aspect or any one of the first to eighth and tenth to twenty-fifth possible modes of implementing the above-mentioned first aspect, the elastic carrier is a thermal conductor, the side of the elastic carrier facing away from the TEC mechanism. it presses against the heat sink, and the hot side of the TEC mechanism transfers heat to the heat sink through the elastic conveyor.
[0045] [045] With reference to the third aspect or the first possible mode of implementation of the third aspect or the second possible mode of implementation of the third aspect or the third possible mode of implementation of the third aspect, in a fourth possible mode of implementation, an issuing portion The heat pipe's heat communicates thermally with the casing.
[0046] [046] With reference to the third aspect or the first possible mode of implementation of the third aspect or the second possible mode of implementation of the third aspect or the third possible mode of implementation of the third aspect or the fourth possible mode of implementation of the third aspect, in In a fifth possible mode of implementation, the heat-emitting portion of the heat pipe can be located at one end of the heat pipe, or in any section of the entire heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS
[0047] [047] FIG. 1 is a schematic diagram of an embodiment of a heat dissipation mechanism in accordance with the present invention.
[0048] [048] FIG. 2 is a schematic diagram of an embodiment of a communications device in accordance with the present invention.
[0049] [049] FIG. 3 is a schematic diagram of an embodiment of another communication device in accordance with the present invention.
[0050] [050] FIG. 4 is a schematic diagram of a TEC mechanism in an embodiment of a heat dissipation mechanism or communication device in accordance with the present invention.
[0051] [051] FIG. 5 is a schematic diagram of an embodiment of a heat pipe and elastic carrier in an embodiment of a heat dissipation mechanism or communication device in accordance with the present invention.
[0052] [052] FIG. 6 is a schematic diagram of another way of assembling a heat pipe and elastic carrier in one embodiment of a heat dissipation mechanism or communication device in accordance with the present invention.
[0053] [053] FIG. 7 is a schematic diagram of yet another mode of assembling a heat pipe and elastic carrier in one embodiment of a heat dissipation mechanism or communication device in accordance with the present invention.
[0054] [054] Cage 2; window 21; second buckle structure 22; TEC 3 mechanism; TEC 31 chip; first ceramic sheet 311; second ceramic sheet 312; 32 metal base; second connector 33; small circuit board 35; mounting case 4; fastener 41; retainer plate 411; first buckle structure 4111; elastic arm 412; support bar 42; elastic beam 43; elastic carrier 5; transport base 51; support base 52; elastic element 53; heat pipe 6; heat absorbing portion 61; heat emitting portion 62; heat dissipation block 63; heat emitting device 7; incarceration device 8; communications device 9; casing 91; 911 frame top box; 912 frame bottom box; circuit board 92; first connector 93; and thermal pad 11. DESCRIPTION OF MODALITIES
[0055] [055] The following are clearly and completely described the technical solutions in the embodiments of the present invention with reference to the attached drawings in the embodiments of the present invention. Apparently, the embodiments described are only some, but not all, of the embodiments of the present invention. All other embodiments obtainable by a person skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention. Heat dissipation mechanism (without an optical module)
[0056] [056] With reference to FIGS. 1 to 3, an embodiment of the present invention provides a heat dissipation mechanism configured to dissipate heat to one of the heat emitter 7, where the heat dissipation mechanism includes: a cage 2, a TEC mechanism 3, a housing case. assembly 4, an elastic carrier 5, and a heat pipe 6, where a window 21 is provided on a side face of the cage 2, the TEC mechanism 3 is located on an outer side of the cage 2, and a cold side of the TEC mechanism 3 passes through window 21 and thermally communicates with heat emitting device 7 in cage 2 so as to dissipate heat from heat emitting device 7; the mounting case 4 is configured to mount the TEC 3 mechanism and allows the TEC 3 mechanism to move in a direction towards or away from the heat emitting device 7; and a heat absorbing portion 61 of the heat tube 6 is mounted on the elastic carrier 5, and the heat absorbing portion 61 of the heat tube 6 that is mounted on the elastic carrier 5 thermally communicates with the hot side of the TEC mechanism 3, so as to dissipate heat from the TEC mechanism 3 by using the heat pipe 6, where one side of the elastic carrier 5 facing away from the TEC mechanism 3 presses against a locking device 8, and the elastic carrier 5 is configured to: when the heat emitting device 7 is inserted into the cage 2 and applies an extrusion force to the outside of the cage 2, and the extrusion force is transferred to the TEC mechanism 3 through the window 21 and transferred to the elastic carrier 5 from the TEC 3 mechanism, undergoes elastic deformation and provides a reaction force to the TEC 3 mechanism and the heat emitting device 7.
[0057] [057] It should be noted that, for ease of illustration of an internal structure of cage 2, FIG. 2 and FIG. 3 show only a sectional view of the cage 2 at a location of the window 21, which can also be easily understood as: a side wall of the cage 2 facing the reader is cut away. For a complete structure of cage 2, refer to FIG. 1.
[0058] [058] In the aforementioned embodiment of the present invention, when an ambient temperature of the heat emitting device is excessively high, the TEC mechanism absorbs heat from the heat emitting device on the cold side of the TEC mechanism through a thermoelectric effect, and releases heat on the hot side, so as to form a cool local area that surrounds the heat emitting device and helps to satisfy a heat emitting device requirement for an operating temperature.
[0059] [059] When the heat emitting device is inserted into the cage, the heat emitting device and the cold side of the TEC mechanism experience a press fit. © heat emitting device pushes the TEC mechanism, and then the TEC mechanism moves in a direction away from the heat emitting device, causing the elastic conveyor carrying the heat tube to also move in the direction it moves. away from the heat emitting device. The elastic carrier is compressed to generate a rebound force towards the heat emitting device, allowing the cold side of the TEC mechanism to come into close contact with the heat emitting device, in a case where a thermally conductive medium is provided between the cold side of the TEC mechanism and the heat emitting device, allowing the cold side of the TEC mechanism to come into close contact with the thermally conductive medium and allowing the thermally conductive medium to come into close contact with the heat emitting device. Therefore, the thermal resistance between the cold side of the TEC mechanism and the heat emitting device is relatively small, and good thermal conduction is implemented. In addition, the rebound force also allows the heat absorbing portion of the heat tube to come into close contact with the hot side of the TEC mechanism, or, in a case where a thermally conductive medium is provided between the absorbing portion. of heat pipe and the hot side of the TEC mechanism, allows the heat absorbing portion of the heat pipe to be in close contact with the thermally conductive medium, and allows the thermally conductive medium to be in close contact with the side. hot from the TEC mechanism. Therefore, the thermal resistance between the heat pipe and the hot side of the TEC mechanism is also relatively small. In summary, when the heat emitting device is inserted into the cage, under the action of the rebound force of the elastic carrier, the thermal contact resistance is relatively small in a thermal conduction path from the heat emitting device to the TEC mechanism and from the TEC mechanism to the heat pipe, facilitating the dissipation of heat generated by the heat emitting device.
[0060] [060] When the heat emitting device is removed from the cage, the elastic carrier recovers from the deformation, and the TEC mechanism moves towards the cage and re-establishes its original location.
[0061] [061] In the thermal conduction path from the heat emitting device to the TEC mechanism and from the TEC mechanism to the heat tube, for the reason that an absolutely precise machining of a device, each device in the thermal conduction path is impossible may have a machining tolerance. Therefore, a greater number of devices in the thermal conduction path indicates a greater accumulated tolerance, and the existence of a tolerance causes a phenomenon that devices cannot properly adjust to each other.
[0062] [062] When the heat emitting device is inserted into the cage, under the action of the rebound force (or can be called the resilience force) of the elastic carrier, the tolerance between devices can be compensated, facilitating proper adjustment between the devices . Thus, the thermal contact resistance is relatively small, facilitating the dissipation of the heat generated by the heat emitting device. In the aforementioned embodiment of the present invention, the heat emitting device may be an optical module. In a case where the heat emitting device is an optical module, the heat dissipation mechanism can efficiently dissipate heat from the optical module as follows. (1) With regard to a specific structure of the cage window and the mounting case:
[0063] [063] Referring to FIG. 1, in a specific mode of implementing the above-mentioned embodiment of the present invention, the mounting case 4 is a catch 41, and the catch 41 can be mounted on the outer side of the cage 2. The catch 41 is mounted on the outer side of cage 2, helping to implement good thermal conduction between the cold side of the TEC 3 mechanism and the heat emitting device.
[0064] [064] The fastener 91 includes two opposingly disposed fastening plates 411 and at least two elastic arms 412 that are connected between the two fastening plates 411. A spring arm 412 of the at least two elastic arms 412 is connected to the upper part of one end of the two clamping plates 411, and the other elastic arm 412 of the at least two elastic arms 412 is connected to the upper part of the other end of the two clamping plates 411.
[0065] [065] At least one first buckle structure 9111 is provided on attachment plates 411. At least one second buckle structure 22 is correspondingly provided on outer faces of two opposite side walls of cage 2.
[0066] [066] With reference to FIG. 2, the catch 41 is mounted on the cage 2 on the outside; the at least two elastic arms 412 of the fastener 41 press against the TEC 3 mechanism, the at least one first buckle structure of the two attachment plates 411 of the fastener 41 co-operate correspondingly with the at least one second buckle structure on the outer faces of the cage, respectively, so as to mount the clamp 41 on the outer side of the cage 2. In addition, the elastic arms 412 of the clamp 41 secure the TEC mechanism 3 on the outer side of the cage 2.
[0067] [067] Optionally, the at least two elastic arms 412 of clamp 41 press against a metal base 32 of the TEC mechanism 3, where a portion of the metal base 32 protrudes from at least two opposite sides of the TEC mechanism 3 , and the elastic arms 412 of the fastener 41 press against the protruding part of the metal base 32.
[0068] [068] When the heat emitting device is inserted into the cage and pushing the TEC mechanism, the TEC mechanism moves in the direction away from the heat emitting device, and the elastic arms of the fastener are elastically deformed. When the heat emitting device is removed from the cage, the TEC mechanism returns to an original location, and the elastic arms of the fastener recover from deformation.
[0069] [069] Mounting the fastener to the outside of the cage allows the TEC mechanism to be quickly and conveniently attached to the cage, which makes mounting easy.
[0070] [070] With reference to FIG. 3, another way of implementing the mounting case is: the mounting case 4 includes at least two support bars 42 and at least one elastic beam 43, where the elastic beam 43 presses against the TEC 3 mechanism, the at least two support bars 42 are connected to elastic beam 43 at one end, support bars 42 are mounted on circuit board 92 at the other end, and the cage is also mounted on circuit board 92.
[0071] [071] Optionally, the elastic beam 43 presses against a metal base 32 of the TEC 3 mechanism, where a portion of the metal base 32 protrudes from at least two opposite sides of the TEC 3 mechanism, and the elastic beam 43 presses against the protruding part of the metal base 32.
[0072] [072] When the heat emitting device is inserted into the cage and pushing the TEC mechanism, the TEC mechanism moves in the direction away from the heat emitting device, and the elastic beam is compressed by the TEC mechanism and becomes elastically deformed. When the heat emitting device is removed from the cage, the TEC mechanism returns to an original location, and the mounting case's elastic beam recovers from deformation.
[0073] [073] Mounting the deformation case onto the circuit board is easy and safe and easy to remove.
[0074] [074] Optionally, the support bars can be screws or bolts.
[0075] [075] In a specific mode of implementing the aforementioned modality, the fact that a window is provided on a side face of the cage specifically includes: the window is provided on the top of the cage (refer to FIG. 1).
[0076] [076] Correspondingly, the fact that the TEC mechanism is located on an outer side of the cage includes: the TEC mechanism is located on the outside of the cage (refer to FIG. 2 or FIG. 3).
[0077] [077] In a specific mode of implementation, a window location can be near an opening end of the cage, and the heat emitting device is inserted into the cage through the opening. In a case where the heat emitting device is an optical module, the design allows the TEC mechanism to better cool a TOSA device (transmitter optical sub-mechanism) or a ROSA device (receiver optical sub-mechanism) that is of the optical module and which is near a location of the cage opening. (2) Thermal pad
[0078] [078] In a specific mode of implementation of the aforementioned modality, the fact that a cold side of the TEC mechanism passes through the window and communicates thermally with the heat emitting device in the cage specifically includes: the cold side of the TEC mechanism passes through the window and thermally communicates with a surface of the heat emitting device in the cage.
[0079] [079] More specifically, the cold side of the TEC mechanism crosses the window and thermally communicates with the upper surface of the heat emitting device in the cage.
[0080] [080] In another implementation-specific mode, the fact that a cold side of the TEC mechanism passes through the window and communicates thermally with the heat emitting device in the cage specifically includes: the cold side of the TEC mechanism passes through the window and makes contact with a surface of the heat emitting device in the cage; or A thermal pad is provided between the cold side of the TEC mechanism and a surface of the heat emitting device, and the cold side of the TEC mechanism passes through the window and dissipates heat from the heat emitting device by using the thermal pad.
[0081] [081] The thermal resistance between the cold side of the TEC mechanism and the heat emitting device can be decreased by providing the thermal pad.
[0082] [082] The thermal pad may be a TIM (Thermal Interface Material) thermal pad.
[0083] [083] In a specific mode of implementation of the aforementioned modality, the fact that the heat absorbing portion that is of the heat tube and that is mounted on the elastic conveyor thermally communicates with the hot side of the TEC mechanism includes: the heat absorbing portion which is of the heat tube and which is mounted on the elastic carrier makes contact with the hot side of the TEC mechanism; or A thermally conductive medium is used to make contact between the heat absorbing portion of the heat tube which is mounted on the elastic carrier and the hot side of the TEC mechanism.
[0084] [084] The thermally conductive medium can be a thermal pad; or the thermally conductive medium is the elastic carrier; or with reference to FIGS. 1 and FIG. 2, the thermally conductive means includes a thermal pad 11 and an elastic carrier 5.
[0085] [085] It can be seen from the preceding descriptions that the elastic carrier carrying the heat tube can absorb, through deformation, a tolerance and a displacement of the TEC mechanism or similar caused when the heat emitting device is inserted or removed . Still additionally, a thermal pad may still be provided between the heat pipe and the TEC mechanism and/or between the TEC mechanism and the heat emitting device. When all elements in the heat dissipation mechanism are assembled together, the tolerance can be absorbed through deformation of the thermal pad. Furthermore, when the heat emitting device is inserted into the cage, an extrusion force exerted by the heat emitting device can also cause deformation of the thermal pad; and therefore, the thermal pad can still absorb the displacement of the TEC mechanism or the like caused when the heat emitting device is inserted or removed. (3) A frame of the elastic conveyor, and various mounting solutions for the elastic conveyor and the heat pipe.
[0086] [086] With reference to FIGS. 5 to 7, in the aforementioned embodiment, in a specific embodiment of the elastic carrier, the elastic carrier may include a carrier 51, where a material of the carrier 51 is an elastic material. There may be a transport base 51 and at least one heat tube 6, and the heat absorbing portion 61 of the at least one heat tube 6 is mounted on the transport base 51; or there are multiple transport bases 51 and multiple heat tubes 6, and the multiple heat tubes 6 are mounted on the multiple transport bases 51 in a distributed mode. Referring to FIG. 7, the heat absorbing portion 61 of the heat tube 6 is mounted on a side face of the transport base 51; or with reference to FIG. 5, the heat absorbing portion 61 of the heat tube 6 is mounted in a receiving groove cutout in the transport base 51; or with reference to FIG. 6, the heat absorbing portion 61 of the heat tube 6 is embedded in the transport base 51. A portion of the heat absorbing portion of the heat tube may protrude from a surface of the transport base; or the heat absorbing portion of the heat pipe may be completely located in the transport base. A part which is from the heat absorbing portion of the heat tube and which protrudes from the transport base makes contact with the hot side of the TEC mechanism; or a heat pad is used to conduct heat between a portion which is of the heat absorbing portion of the heat tube and which protrudes from the transport base and the hot side of the TEC mechanism; or the transport base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism, where the transport base is a thermal conductor; or a thermally conductive medium provided in the transport base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism.
[0087] [087] In the above-mentioned modality, a shape of the transport base can be a plate shape or a flat shape.
[0088] [088] With reference to FIG. 1, in the aforementioned embodiment of the present invention, in another specific mode of implementing the elastic carrier 5, the elastic carrier 5 may include a support base 52, and an elastic element 53 located on an outwardly facing side of the carrier base 52 of the TEC mechanism 3. There may be a support base 52 and at least one heat tube 6, and the heat absorbing portion 61 of the at least one heat tube 6 is mounted on the support base 52; or there are multiple support bases 52 and multiple heat tubes 6, and the multiple heat tubes 6 are mounted on the multiple support bases 52 in a distributed mode. Furthermore, similar to the previously described mounting mode of the heat tube and support base, the heat absorbing portion of the heat tube is mounted on a side face of the support base; or the heat absorbing portion of the heat tube is mounted in a receiving groove cutout in the support base; or the heat absorbing portion of the heat tube is embedded in the support base. A part which is of the heat-absorbing portion of the heat tube and which protrudes from the support base makes contact with the hot side of the TEC mechanism; or a thermal pad is used to conduct heat between a portion which is of the heat absorbing portion of the heat tube and which protrudes from the support base and the hot side of the TEC mechanism; or the support base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism, where the support base is a thermal conductor; or a thermally conductive medium provided in the support base is used to conduct heat between the heat absorbing portion of the heat pipe and the hot side of the TEC mechanism.
[0089] [089] In the above-mentioned modality, a shape of the transport base can be a plate shape or a flat shape.
[0090] [090] The elastic element can be a spring plate, a spring, or rubber. The elastic element can be a thermal conductor or a non-thermal conductor.
[0091] [091] The elastic element can be fixed, using screws, on the side of the support base facing the outside of the TEC mechanism.
[0092] [092] Corresponding to the two modes of implementation of the elastic carrier, the fact that one side of the elastic carrier facing away from the TEC mechanism presses against a cage device specifically includes: the cage device is a heat sink, the base of transport is a thermal conductor, the side of the transport base facing the outside of the TEC mechanism presses against the heat sink, and the warm side of the TEC mechanism transfers heat to the heat sink through the transport base; or the cage device is a heat sink, the supporting base and elastic element are thermal conductors, the elastic element presses against the heat sink, and the hot side of the TEC mechanism transfers heat to the heat sink through the base of support and the elastic element. (4) TEC Mechanism
[0093] [093] With reference to FIG. 1, in a feasible mode of implementing the aforementioned embodiment, the TEC 3 mechanism includes a TEC 31 chip. The TEC 31 chip includes two oppositely disposed ceramic sheets and a semiconductor located and positioned between the two ceramic sheets. The two ceramic sheets are a first ceramic sheet 311 and a second ceramic sheet 312, respectively. The first ceramic sheet 311 can function as the cold side, and the second ceramic sheet 312 can function as the hot side.
[0094] [094] In addition, the TEC mechanism 3 may further include a metal base 32. The metal base 32 is attached to one side of the first ceramic sheet 311 facing away from the semiconductor, and the metal base 32 functions as the cold side together with the first ceramic sheet 311.
[0095] [095] The metal base passes through the window and thermally communicates with the heat emitting device. The metal base can be provided as a frame with a wide top and a narrow bottom. The bottom can go through the window, and the top can be left outside the window.
[0096] [096] A thermal pad or other thermally conductive medium may further be provided on the first ceramic sheet 311. The thermal pad or other thermally conductive medium may function as the cold side of the TEC mechanism together with the first ceramic sheet 311.
[0097] [097] In addition, the TEC mechanism can also include a thermistor. A thermistor refers to a resistor whose resistance value varies regularly with temperature. A function of the thermistor is to feed back a temperature from the cold side of the TEC chip to a circuit board or a control board, and then the circuit board or control board adjusts the input power of the TEC chip according to the temperature. which is fed back. There are many ways to implement the thermistor. Another use of the thermistor is to reflect the temperature of the heat emitting device. Specifically, the thermistor can be positioned on the metal base. Optical module mechanism (with an optical module)
[0098] [098] With reference to FIG. 2 and FIG. 3, an embodiment of the present invention further provides an optical module mechanism, which includes the heat dissipation mechanism in the aforementioned embodiment, an optical module, and a first connector 93. The optical module functions as the heat emitting device 7 in the heat dissipation mechanism In the aforementioned embodiment, the optical module and the first connector 93 are located in the cage 2 of the heat dissipation mechanism, and the optical module and the first connector 93 are communicatively connected. communications device
[0099] [099] With reference to FIG. 2 and FIG. 3, an embodiment of the present invention further provides a communication device 9. The communication device 9 includes a housing 91, a circuit board 92, a first connector 93, and the heat dissipation mechanism in the aforementioned embodiment, where the circuit board 92, first connector 93, and heat dissipation mechanism are located in housing 91. first connector 93 and cage 2 are positioned on a same surface of circuit board 92, first connector 93 is located in cage 2 at one end of cage 2, and the heat emitting device 7 is inserted into cage 2 from an end of cage 2 facing away from the first connector 93 and is communicatively connected to the first connector 93.
[0100] [100] In a mode of implementing the aforementioned embodiment of the present invention, the housing 91 functions as the cage device 8 mentioned in the aforementioned heat dissipation mechanism embodiment, and the elastic carrier 5 side facing away from the mechanism TEC 3 presses against housing 91.
[0101] [101] In a mode of implementing the aforementioned embodiment of the present invention, a heat-emitting portion 62 of the heat pipe 6 thermally communicates with the housing 91.
[0102] [102] The communications device in the above-mentioned embodiment of the present invention may be an RRU (Remote Control Unit, remote control unit).
[0103] [103] With reference to FIGS. 2 and FIG. 3, the communication device 9 in the aforementioned embodiment of the present invention may further include the optical module. The optical module functions as the heat emitting device 7 in the heat-dissipating mechanism in the aforementioned embodiment, and the optical module is located in the cage 2 of the heat-dissipating mechanism.
[0104] [104] In the above-mentioned embodiment of the present invention, heat from the heat-emitting portion of the heat pipe is dissipated using the housing. In addition, the housing can be provided with a heat sink, and heat from the heat-emitting portion of the heat pipe is dissipated using the housing and the heat sink.
[0105] [105] Referring to FIG. 2, in the aforementioned embodiment of the present invention, the housing 91 may include an upper frame box 911 and a lower frame box 912, and the side of the elastic carrier 5 facing away from the TEC mechanism 3 presses against the upper frame box. frame 911. Heat from the heat emitting portion 62 of the heat pipe 6 is dissipated by using the frame top box 911. In addition, the frame top box 911 can be provided with a heat sink, and heat from the frame emitting portion of heat 62 from heatpipe 6 is dissipated using the frame top box 911 and the heat sink.
[0106] [106] In an optional mode of implementing the above-mentioned embodiment of the present invention, the communications device further includes a protective cover. The protective cover is located on the housing and between the circuit board and lower frame box.
[0107] [107] In the aforementioned embodiment of the present invention, the heat absorbing portion of the Heat Lube may be located at one end of the heat pipe, or in any section of the entire heat pipe. Similarly, the heat-emitting portion of the heat pipe may be located at one end of the heat pipe, or in any section of the entire heat pipe. Referring to FIG. 2, the heat-emitting portion 62 of the heat tube may also be carried in a heat-dissipating block 63.
[0108] [108] In an optional mode of implementing the above-mentioned embodiment of the present invention, the heat-emitting portion of the heat pipe is attached to the casing. In addition, the heat-emitting portion of the heat tube is attached to the upper frame box or the lower frame box. For example, the heat-emitting portion of the heat pipe (which may be one end of the heat pipe) is fastened, using screws, to the upper frame box or lower frame box to secure the entire heat pipe. (1) Cage, heat emitting device and connector
[0109] [109] In an optional mode of implementing the aforementioned embodiment of the present invention, the cage is attached to the circuit board in a form of crimp.
[0110] [110] In an implementation-specific mode, the first connector is attached to the circuit board and is communicatively connected to the circuit board. The first connector can be attached to the circuit board in a surface mount mode, a plug connection mode, or similar, and is communicatively connected to the circuit board.
[0111] [111] In a specific mode of implementation, the fact that the heat emitting device is inserted into the cage from one end of the cage facing away from the first connector and is communicatively connected to the first connector specifically includes: the heat emitting device is inserted into the cage from an end of the cage facing away from the first connector and is communicatively connected to the first connector using an edge connector or a guide pin on the front of the heat emitting device.
[0112] [112] In the aforementioned embodiment of the present invention, the cage is configured to provide protection to the heat emitting device, and to provide an orientation and limiting function in a process in which the heat emitting device is inserted into the cage and is interconnected to the first connector. Furthermore, the cage may further provide a function of fixing the relative positions of the first connector and the heat emitting device. (2) Second connector between TEC mechanism and circuit board
[0113] [113] With reference to FIG. 2, FIG. 3 or FIG. 4, the TEC mechanism further includes a second connector 33. The second connector 33 and the circuit board are communicatively connected. The circuit board supplies electrical power to the TEC chip 31 by using the second connector 33. Furthermore, in a case where the TEC mechanism is provided with a thermistor, the circuit board acquires a thermistor temperature by using the second connector 33 , and controls, by using the second connector 33 according to the temperature of the thermistor, the TEC 31 chip to dissipate heat to or heat the heat emitting device so as to maintain the temperature of the heat emitting device at an operating temperature .
[0114] [114] The second connector can be mounted on a metal base of the TEC mechanism. The second connector may be adjacent to the end of the cage in which the first connector is positioned. The second connector can be a blind mating connector.
[0115] [115] With reference to FIG. 4, in an optional mode of implementing the aforementioned embodiment of the present invention, the TEC mechanism further includes a small circuit board 35. The small circuit board 35 is configured to electrically connect a power cable from the TEC chip 31 to a pin contact of the second connector 33.
[0116] [116] In the aforementioned embodiment of the present invention, the circuit board is a board, a backboard, or a service board. The cage can also be called a cage.
[0117] [117] In all of the aforementioned embodiments of the present invention, the first connector can be an electrical connector or an optical connector, and the second connector can be an electrical connector or an optical connector.
[0118] [118] In the descriptions of the present invention, it should be understood that a relationship of position or location indicated by terms such as "center", "above", "below", "front", "rear", "left", "right ", "vertical", "horizontal", "top", "bottom", "inside", and "outside", is a relationship of position or location that is based on the illustration in the accompanying drawings. These terms are merely for ease of description of the present invention and for simplified descriptions, but do not indicate or imply that a mentioned equipment or component must have a specific position or must be built or operated in a specific position and therefore should not be understood as limitations of the present invention.
[0119] [119] The terms "first" and "second" are merely for the purpose of description and may not be understood as indicating or implying relative importance, or implicitly indicating a quantity of the indicated technical resource. Therefore, a feature defined by "first" or "second" may explicitly indicate or implicitly include one or more such features. In the descriptions of the present invention, unless otherwise mentioned, "multiple" means two or more than two.
[0120] [120] In the descriptions of the present invention, it should be noted that, unless otherwise clearly specified or defined, the terms "assemble", "interconnect" and "connect" are to be understood in the general sense. For example, there can be a fixed connection, a detachable connection, or an integral connection; there can be a direct interconnection, an indirect interconnection through an intermediary medium, or an internal connection between two components. A person skilled in the art can understand specific meanings of the above mentioned terms in the present invention according to specific circumstances.
[0121] [121] In the descriptions in this patent application, a specific feature, structure, material or characteristic may be combined in any one or more modalities or examples in a suitable way.
[0122] [122] Furthermore, the term "and/or" in this patent application describes only one association relationship to describe associated objects and represents that there can be three relationships. For example, A and/or B can represent the following three cases: there is only A, there are both A and B, and there is only B. In addition, the "/" character in this patent application generally indicates an "or" relationship between the associated objects.
[0123] [123] The above descriptions are merely specific modes of implementation of the present invention, but are not intended to limit the scope of protection of the present invention. Any variation or substitution easily discovered by a person skilled in the art within the technical scope disclosed in the present invention shall fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

权利要求:
Claims (3)
[0001]
function as the locking device (8) in the heat dissipation mechanism according to any one of claims 1 to 9 and claims 11 to 18, and the side of the elastic carrier (5) facing away from the TEC mechanism (3) does pressure against the casing (91).
[0002]
Communications device (9), according to claim 20, CHARACTERIZED by the fact that a heat-emitting portion (62) of the heat tube (6) communicates thermally with the casing (91).
[0003]
Communications device (9), according to claim 20, CHARACTERIZED in that the communications device (9) further comprises a heat sink, the heat sink functioning as the entrapment device (8) in the heat dissipation mechanism defined in any one of claims 1 to 9 and claims 11 to 18, the elastic carrier (5) is a thermal conductor, the side of the elastic carrier (5) facing away from the TEC mechanism (3) presses against the heat sink , and the hot side of the TEC mechanism (3) transfers heat to the heat sink through the elastic conveyor (5).

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同族专利:

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CN106793669A|2017-05-31|

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EP3171209A1|2017-05-24|

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法律状态:
2017-08-08| B12F| Appeal: other appeals|

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2021-06-22| B150| Others concerning applications: publication cancelled|Free format text: ANULADA A PUBLICACAO CODIGO 15.21 NA RPI NO 2421 DE 30/05/2017 POR TER SIDO INDEVIDA. |

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2021-07-27| B15G| Petition not considered as such [chapter 15.7 patent gazette]|Free format text: NAO CONHECIDA A PETICAO NO 800170126714 DE 20/04/2017 EM VIRTUDE DO DISPOSTO NO ART. 219, INCISO II DA LPI. |

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2021-08-03| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|

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2021-08-17| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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CN201510808794.9A|CN106793669B|2015-11-20|2015-11-20|A kind of radiating subassembly and communication equipment|

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CN201510808794.9|2015-11-20|

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